Trade News Archives - Page 54 of 94 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Page 54

We are a professional Semiconductor BGA substrate, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate and PCBs.

Rigid-Flex BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Rigid-Flex Packaging Substrate. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

We are a professional Semiconductor substrate, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and PCBs.

Ceramic Packaging Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.high frequency materials.

Sisi ni wataalamu wa IC Substrate, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate and PCBs.