Trade News Archives - Ukurasa 56 ya 94 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 56

BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.

We are a professional FCBGA Packaging, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and PCBs.

We are a professional FCBGA package, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate.

FCBGA package Substrate.High speed material packaging substrate manufacturing. Advanced packaging substrate production process.

Kifurushi cha ufungaji. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, Sehemu ndogo za unganisho za multilayer kutoka 4 kwa 18 tabaka,

Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.