Trade News Archives - Ukurasa 55 ya 94 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD

IC Substrate ni nini?
Desemba 20, 2023 Habari / Habari za Biashara
Sisi ni wataalamu wa IC Substrate, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate and PCBs.
Soma zaidi
Substrate ya ABF ni nini?
Desemba 19, 2023 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
We are a professional ABF Substrate Manufacturer, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate.
Soma zaidi
What is FCBGA substrate?
Desemba 18, 2023 Habari / Habari za Biashara
FCBGA substrate: Optimal 100um bump pitch, 9um trace and gap for compact design. Typical: 15-30um trace and spacing.
Soma zaidi
What is FCBGA packaging substrate?
Desemba 15, 2023 Habari / Habari za Biashara
FCBGA packaging substrate: Optimal 100um bump pitch, 9um trace and gap for compact design. Typical: 15-30um trace and spacing.
Soma zaidi
What is Package Substrate?
Desemba 14, 2023 Habari / Habari za Biashara
Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process.
Soma zaidi
What is Flip Chip Packaging Substrate?
Desemba 13, 2023 Habari / Habari za Biashara
Produce top-tier Flip Chip Packaging Substrate with 100um bump pitch, 9um trace, and 9um gap for optimal performance.
Soma zaidi