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BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.

We are a professional FCBGA Packaging, Nous produisons principalement un substrat de pitch ultra-petit, ultra-small trace and PCBs.

We are a professional FCBGA package, Nous produisons principalement un substrat de pitch ultra-petit, substrat d'emballage de trace et d'espacement ultra-petit.

FCBGA package Substrate.High speed material packaging substrate manufacturing. Advanced packaging substrate production process.

Packaging Substrate. Nous utilisons la technologie avancée MSAP et SAP, Substrats d'interconnexion multicouche élevés de 4 à 18 couches,

Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.