Archives d'information commerciale - Page 57 de 94 - TECHNOLOGIE ALCANTA(SHENZHEN)CO., LTD - Page 57

We are a professional Substrate package technology development Inte, Nous produisons principalement un substrat de pitch ultra-petit, Trace ultra-petite trace et substrat d'emballage d'espacement et PCB.

We are a professional Substrate for semiconductor packaging, we mainly produce ultra-small trace and spacing packaging substrate and PCBs.

We are a professional Substrate cross section ic package, Nous produisons principalement un substrat de pitch ultra-petit, Trace ultra-petite trace et substrat d'emballage d'espacement et PCB. In the field of modern electronics, packaging substrates are key components of electronic devices and play an important role in facilitating circuit connections, improving performance and…

We are a professional Semiconductor package substrates, we mainly produce ultra-small trace and spacing packaging substrate and PCBs. In the rapidly evolving landscape of the electronics industry, semiconductor packaging substrates have emerged as indispensable catalysts for technological advancement. This article aims to offer a comprehensive exploration of the fundamental concepts…

bt-materials-pcb. we have produced boards with BT material. This material has different thicknesses. Like: 0.1MM. 0.15MM.0.2MM.0.25MM.0.3mm to 1.6mm. We produce the BT PCB with High quality and fast lead time. BT resin materials have excellent mechanical, thermique, and electrical properties.

We are a professional Pathfinding department substrate and packaging technology development, we mainly produce ultra-small trace and PCBs. In the current landscape of rapid technological advancement, the Pathfinding Department stands as a linchpin in the realm of packaging technology. As a vanguard within the engineering domain, the department's commitment to…