What is Rogers 4350b PCB?

Rogers 4350B PCB Supplier , Ro 4350B PCB Manufacturing. Dk of 3.48 +/- 0.05, Dissipation factor of 0.0037 at 10 GHz, High quality PCB de Rogers Supplier. Fast shipping time. and Low cost. we will help you save time.

RO4350B laminates provide tight control on dielectric constant (Dk) and maintain low loss while utilizing the same processing method as standard epoxy/glass. Available at a fraction of the cost of conventional microwave laminates, RO4350B laminates do not require the special through-hole treatments or handling procedures as PTFE based materials. These materials are UL 94 V-0 rated for active devices and high power RF designs.

Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/ glass.

Features
Dk of 3.48 +/- 0.05
Dissipation factor of 0.0037 at 10 GHz
Low Z-axis coefficient of thermal expansion at 32 ppm/°C
Benefits
Processes like FR-4 at lower fabrication cost
Competitively priced
Excellent dimensional stability

RO4003C™ laminates are currently offered in various confi gurations utilizing
both 1080 and 1674 glass fabric styles, with all confi gurations meeting the
same laminate electrical performance specifi cation. Specifi cally designed
as a drop-in replacement for the RO4003C™ material, RO4350B™ laminates
utilize RoHS compliant fl ame-retardant technology for applications requiring
UL 94V-0 certifi cation. These materials conform to the requirements of IPC4103, slash sheet /10 for RO4003C, see note #1 for RO4350B slash sheet determination.

Exploring RO4350B PCB: High-Performance Substrate for Advanced Electronics

RO4350B PCB, manufactured by Rogers Corporation, represents a cutting-edge substrate material widely used in high-frequency printed circuit boards (PCBs) for various applications. Renowned for its exceptional electrical properties and thermal stability, RO4350B PCB plays a crucial role in enabling the development of advanced electronic devices that require reliable performance in demanding environments.

En son coeur, RO4350B is a thermoset laminate material composed of woven fiberglass reinforced with polytetrafluoroethylene (PTFE) resin. This unique composition gives RO4350B its distinctive characteristics, including a low dielectric constant (Dk) and low dissipation factor (Df), making it an ideal choice for high-frequency applications where signal integrity is paramount.

One of the key advantages of RO4350B PCB is its excellent electrical performance across a wide range of frequencies. The low Dk of RO4350B ensures minimal signal loss and dispersion, allowing for efficient signal transmission at high frequencies. This makes RO4350B PCBs suitable for applications such as wireless communication systems, radar systems, satellite communications, and high-speed data networks, where reliable signal transmission is critical for optimal performance.

En outre, RO4350B PCB offers exceptional dimensional stability and thermal conductivity, making it well-suited for applications that require reliability in harsh operating conditions. The high glass transition temperature (Tg) of RO4350B ensures excellent mechanical strength and resistance to thermal stress, while its low moisture absorption properties make it suitable for outdoor and high-humidity environments.

In addition to its outstanding electrical and thermal properties, RO4350B PCB is also highly compatible with a variety of manufacturing processes, including standard PCB fabrication techniques such as drilling, routing, and soldering. This versatility allows for easy integration into existing manufacturing workflows, streamlining the production process and reducing time-to-market for electronic products.

RO4350B PCBs are available in various thicknesses and copper weights to accommodate a wide range of design requirements. Whether it’s single-sided, double-sided, or multilayer PCBs, RO4350B can be tailored to meet the specific needs of different applications, from high-frequency RF/microwave circuits to high-speed digital signal processing.

Moreover, RO4350B PCBs can be easily combined with other materials and technologies to create hybrid PCB designs that offer additional functionality and performance benefits. For example, RO4350B can be used in conjunction with FR-4 substrates to create mixed-material PCBs that strike a balance between cost-effectiveness and high-frequency performance.

In conclusion, RO4350B PCB represents a state-of-the-art substrate material that delivers exceptional electrical performance, thermal stability, and reliability for high-frequency applications. With its low dielectric constant, excellent dimensional stability, and compatibility with various manufacturing processes, RO4350B PCB enables the development of advanced electronic devices that push the boundaries of performance and innovation. As the demand for high-frequency electronics continues to grow, RO4350B PCB will play an increasingly important role in shaping the future of connectivity and communication.

NOTES:
(1) RO4350B 4 mil laminates have a process Dk of 3.33 ± 0.05 and are in conformance with IPC-4103A/240. All other RO4350B laminate thicknesses are /11 and /240 compliant.

(2) The design Dk is an average number from several different tested lots of material and on the most common thickness/s.

(3) RO4350B LoPro® laminates do not share the same UL designation as standard RO4350B laminates. A separate UL qualifi cation may be necessary.

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