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Semiconductor BGA substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate
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Semiconductor IC substrate Manufacturer. мы можем изготовить самый лучший шаг неровностей с толщиной 100 мкм, лучший наименьший след — 9 мкм.
Ceramic package substrate Manufacturer
Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 к 18 слои
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Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
Substrate Packaging Manufacturer
Substrate Packaging Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 к 18 слои,
Top 10 Packaging Substrate Manufacturer
Top 10 Packaging Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace packaging substrate from 2~20L
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