Global package Substrate Manufacturer
Global package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production.
Module Substrates Manufacturer
Module Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs from 4 слой в 20 слои.
Global Semiconductor Substrate Manufacturer
Global Semiconductor Substrate Manufacturer. We use advanced Msap and Sap technology to manufacturing High multilayer interconnection package substrates.
CPCORE Structure Manufacturer
CPCORE Structure Manufacturer. Мы используем расширенную технологию MSAP и SAP для производства высокопоставленных подложков взаимодействия с 4 к 18 слои.FC-CSP Substrates Manufacturer
FC-CSP Substrates Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other types base materials.
High Speed package Substrate Manufacturer
High Speed package Substrate Manufacturer. High speed and high frequency material PCB and packaging substrate manufacturing.
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