Semiconductor Package Substrate: The Cornerstone of Modern Electronics
In the dynamic realm of contemporary electronics, semiconductor packaging substrates assume a pivotal and irreplaceable role. They serve as the very bedrock of electronic equipment, delivering essential support and protection for intricate circuits. The choice and performance of packaging substrate materials wield a profound influence on the efficacy, dependability, и…
Unlocking the Potential of Organic Substrate Packaging
In the rapidly developing electronics field, the importance of organic substrate packaging cannot be ignored. As a core component of electronic equipment, it affects performance, reliability and cost. Organic substrate packaging provides a solid foundation for our devices, allowing us to rely on a variety of innovative electronic products in…
Future Trends: Technological Evolution of FCBGA Packaging Substrate
Подложка для упаковки FCBGA (Flip Chip Ball Grid Array packaging substrate) is a crucial technology in the electronics industry. In this information age, the electronic devices around us are becoming smaller and lighter, but they require more performance and reliability. This is the importance of FCBGA packaging substrate. Think of the…
How FCBGA Packaging Substrate Drives Innovation in the Electronics Industry？
The FCBGA (Flip Chip Ball Grid Array) packaging substrate is a key component of this technology and plays an indispensable role. FCBGA packaging substrate provides a highly integrated solution that can achieve more functions, higher performance and lower energy consumption in miniaturized electronic devices. This compact packaging method not only…
Diverse Application Fields of Packaging Substrate
We have made Quick-turn-circuit-boards. to produce the quick turn boards. we only need 1 или 2 дни. the PCB via holes are 0.15mm. line to line spacing is 0.08mm. pcb boards thick is 0.2mm to 3.0mm. pcb copper thick is 35um to 210um. about the pcb soldermask colour. we can…
Flip Chip Package Substrate Manufacturer
Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 слой в 18 слои. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.
Тел.: +86 (0)755-8524-1496
Электронная почта: info@alcantapcb.com