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RF Modules Substrate Manufacturer. High frequency and High speed material packaging substrate production. We offer advanced microtrace RF packaging substrate from 2 capa a 30 capas.

Metal Core PCB Manufacturer, Super-thick Copper PCBs, Heavy copper PCBs, and thicker Metal base PCBs manufacture, we offer Metal core PCB and Aluminium base from 1 capa a 30 capas.

Microtrace BGA substrates Manufacturer. Microtrace and Microgap HDI PCBs production, Utilizamos tecnología avanzada Msap y Sap para producir sustratos de alta interconexión multicapa a partir de 2 a 30 capas.

Ultrathin LED PCB Manufacturer. 1 capa o 2 layer PCBs finished boards thickness are 3mil(75uno), 4mil(100uno) to 6mil to 8mil, el 4 layer PCBs will be finsihed with 7mil to 15mil. or more thicker.

Ro3006 PCB Manufacturer. Rogers Series material PCB and Mixed medium Rogers PCBs production, We offer High Frequency PCBs. Como: ro3003, ro3006, Ro3010,Ro4360G2, Ro4835, Ro 4350B, ro5880, and other types High Frequency boards, como: CLTE, Genclad, RF35,FastRise27,TLC, TLX, TLY, tacónico 601, 602, 603, 605.

RF High Frequency Flip Chip Substrate Manufacturer. we can produce the best smallest bump pitch with 100um, La mejor traza más pequeña son 9um.