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Radar HF substrate Manufacturer, we mainly produce ultra-small bump pitch Radar HF substrate from 2 capa a 30 capas, ultra-small trace and spacing BGA packaging substrate or HDI PCBs.

Glass Package Substrates Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4,

Fabricante de PCB duro ultrafino. the finished boards thickness are from 3mil(0.07milímetros), 0.1milímetros, 0.12milímetros, 0.15milímetros, 0.17mm to 0.3mm. Rigid core(base) materials Ultra-thin PCBs Vendor. Como: Materiales altos TG FR4, BT materials, and other High speed and high frequency materials. we use this types hard core to produce the Ultra-thin boards…

Fabricante de PCB de alta frecuencia Rogers RT5880. Para la antena, Radar, Aviación, Proveedor de PCB Rogers RT5880. Ofrecemos Rogers 5880 PCB con capa dieléctrica mixta, Cavidad, PCB integrados de Cavity Rogers. Hemos fabricado este tipo de PCB Rogers a partir de 2 capa a 30 capas. Alta calidad y tiempo de envío rápido..

Fabricante de sustratos BGA para unión de cables, Producimos principalmente sustratos de paso ultrapequeño., ultra-small trace and spacing packaging. Unión de cables BGA/IC. Materiales de alta frecuencia y alta frecuencia Sustratos BGA de unión de cables.

Mini led PCB Substrate Manufacturer. The Ultra-small spacing LED PCBs will be made with BT core materials. the pads go pads gap tolerance will be more easy to control, and the finished boards will be more flat. we can use the High speed and high frequency material to do the…