Organic Packaging Chip Substrates Manufacturer
Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 слой в 20 слои.
Global Packaging Substrate Manufacturer
Global Packaging Substrate Manufacturer. мы можем изготовить самый лучший шаг неровностей с толщиной 100 мкм, лучший наименьший след — 9 мкм.
Top 10 package Substrate Manufacturer
Top 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 слой в 20 слои.
Global Semiconductor packaging Manufacturer
Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.
Global package Substrate Manufacturer
Global package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production.
Module Substrates Manufacturer
Module Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs from 4 слой в 20 слои.
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