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Semiconductor substrate supplier. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Semiconductor FC BGA substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

We are a professional Semiconductor BGA substrate, Producimos principalmente sustratos de paso ultrapequeño., Sustratos de embalaje y PCB con espaciado y trazas ultrapequeños.

Rigid-Flex BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Rigid-Flex Packaging Substrate. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

We are a professional Semiconductor substrate, Producimos principalmente sustratos de paso ultrapequeño., ultra-small trace and PCBs.