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Substrato de embalagem cerâmica. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Semiconductor substrate supplier. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Semiconductor FC BGA substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Somos um substrato BGA semicondutor profissional, Produzimos principalmente substrato de pitch bump ultra-pequeno, ultra-small trace and spacing packaging substrate and PCBs.

Rigid-Flex BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Rigid-Flex Packaging Substrate. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.