Arquivos de notícias - Página 59 de 101 - TECNOLOGIA ALCANTA(SHENZHEN)CO., LTD - Página 59

Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process.

Produce top-tier Flip Chip Packaging Substrate with 100um bump pitch, 9um trace, and 9um gap for optimal performance.

Substrato BGA. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.

We are a professional FCBGA Packaging, Produzimos principalmente substrato de pitch bump ultra-pequeno, ultra-small trace and PCBs.

We are a professional FCBGA package, Produzimos principalmente substrato de pitch bump ultra-pequeno, Substrato de embalagem de traço e espaçamento ultra-pequeno.

FCBGA package Substrate.High speed material packaging substrate manufacturing. Advanced packaging substrate production process.