Archives d'actualités - Page 59 de 101 - TECHNOLOGIE ALCANTA(SHENZHEN)CO., LTD - Page 59

Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process.

Produce top-tier Flip Chip Packaging Substrate with 100um bump pitch, 9um trace, and 9um gap for optimal performance.

BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.

We are a professional FCBGA Packaging, Nous produisons principalement un substrat de pitch ultra-petit, ultra-small trace and PCBs.

We are a professional FCBGA package, Nous produisons principalement un substrat de pitch ultra-petit, substrat d'emballage de trace et d'espacement ultra-petit.

FCBGA package Substrate.High speed material packaging substrate manufacturing. Advanced packaging substrate production process.