Archives d'actualités - Page 61 de 101 - TECHNOLOGIE ALCANTA(SHENZHEN)CO., LTD - Page 61

bt-materials-pcb. we have produced boards with BT material. This material has different thicknesses. Like: 0.1MM. 0.15MM.0.2MM.0.25MM.0.3mm to 1.6mm. We produce the BT PCB with High quality and fast lead time. BT resin materials have excellent mechanical, thermal, and electrical properties.

We are a professional Pathfinding department substrate and packaging technology development, we mainly produce ultra-small trace and PCBs. In the current landscape of rapid technological advancement, the Pathfinding Department stands as a linchpin in the realm of packaging technology. As a vanguard within the engineering domain, the department's commitment to…

Packaging substrate manufacturers and package substrate manufacturer. Nous utilisons la technologie avancée MSAP et SAP, Substrats d'interconnexion multicouche élevés de 4 à 18 couches. En tant que composante fondamentale des appareils électroniques, Les substrats d'emballage jouent un rôle crucial dans la technologie moderne. Au-delà de servir de base pour les connexions de circuit, they act as…

Packaging substrate materials names and package substrate manufacturer. Nous utilisons la technologie avancée MSAP et SAP, Substrats d'interconnexion multicouche élevés de 4 à 18 couches. Packaging substrate materials, as core components of modern electronic devices, play a vital role. These materials serve both as support structures for circuits and as critical…

Packaging substrate definition and package substrate manufacturer. Nous utilisons la technologie avancée MSAP et SAP, Substrats d'interconnexion multicouche élevés de 4 à 18 couches. In the realm of contemporary electronics, packaging substrates emerge as integral components within electronic devices, shouldering the crucial responsibilities of connection, soutien, and protection for electronic elements.…

Package substrate tools and package substrate manufacturer. Nous utilisons la technologie avancée MSAP et SAP, Substrats d'interconnexion multicouche élevés de 4 à 18 couches. Package substrate tools play an integral role in modern electronics manufacturing. In the rapidly developing technology field, Package Substrate Tools are not just simple devices, but also…