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3D Ceramic Packages Substrate manufacturing, Advanced production technology. we offer 2D Ceramic Substrate, 2.5D Ceramic Substrate.

Mixed dielectric PCB manufacturing.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Microvia Substrates manufacturing. the best smallest vias holes size are 50um. the Package Substrate will be made with BT core, Showa Denko and Ajinomoto High speed materials. or other types core materials.

Mini Ceramics PCB manufacturing. possiamo produrre il miglior bump pitch con 100um, la migliore traccia più piccola è 9um.

Embedded IC PCB manufacturing. Open Depth control slot on the PCBs. Put the IC in the slot of the PCBs. we can use the High frequency and high speed materials.

Embedded cavity PCB manufacturing. Open a Depth control cavity on the PCBs. or multi-cavity on the PCBs. we have made many this cavity PCB from 4 strato a 30 strati. to use the High frequency and high speed materials.