News Archives - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD

FC-BGA design rules & production process capabilities FC-BGA design rules & Production process capabilities, FC-BGA substrates are semiconductor packages with fine design rule and high reliability,The standard FCBGA packaging substrate design is 8 A 16 strati, and the material used is Japanese ABF (Ajinomoto) film, for example: GX92R, GXT31R2, GZ41R2H,…

Custom BGA/IC Substrates play a crucial role in modern semiconductor packaging, serving as the bridge between the silicon chip and the printed circuit board (PCB). IC substrates provide electrical connections, supporto meccanico, and thermal dissipation pathways, ensuring the functionality and reliability of advanced electronic devices. Among various packaging technologies, Ball…

The rapid evolution of semiconductor technology has driven the need for more advanced packaging solutions to meet the increasing demands of high-performance computing, AI, and data-intensive applications. Traditional organic and silicon-based substrates are facing limitations in electrical performance, gestione termica, and miniaturization. As a result, Custom Glass Class Package Substrate…

Un frame di piombo QFN/QFP personalizzato è un framework in metallo specializzato progettato per fornire connessioni elettriche, supporto meccanico, e dissipazione termica per dispositivi a semiconduttore usando QFN (Quad Flat No-Lead) o qfp (Pacchetto quad piatto) confezione. Questi frame di lead sono personalizzati per soddisfare i requisiti di progettazione e prestazioni specifici, garantendo funzionalità ottimale in…

Custom FCBGA Package Substrate Service plays a pivotal role in advancing modern semiconductor packaging solutions. As a tailored service, it focuses on designing and manufacturing specialized substrates for FCBGA (Flip-Chip Ball Grid Array) confezione, a technology widely recognized for its high-performance and miniaturization capabilities. FCBGA packaging relies on flip-chip technology…

Semiconductor packaging plays a crucial role in modern electronics, serving as the bridge between integrated circuits (circuiti integrati) and external components. It not only protects delicate semiconductor chips but also ensures efficient electrical connections and thermal management. As electronic devices become more compact and powerful, advanced packaging solutions are essential to…