Rigid-Flex Packaging Substrate Firm
Rigid-flex packaging substrate Firm. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates.
Semiconductor FC-BGA substrate Manufacturer
Semiconductor FC-BGA substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection.
Semiconductor BGA substrates Manufacturer
Semiconductor BGA substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate
Semiconductor IC substrate Manufacturer
Semiconductor IC substrate Manufacturer. мы можем изготовить самый лучший шаг неровностей с толщиной 100 мкм, лучший наименьший след — 9 мкм.
Ceramic package substrate Manufacturer
Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 к 18 слои
Substrate package Manufacturer
Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
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