Substrate Packaging Manufacturer
Substrate Packaging Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 к 18 слои,
Top 10 Packaging Substrate Manufacturer
Top 10 Packaging Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace packaging substrate from 2~20L
Organic Packaging Chip Substrates Manufacturer
Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 слой в 20 слои.
Global Packaging Substrate Manufacturer
Global Packaging Substrate Manufacturer. мы можем изготовить самый лучший шаг неровностей с толщиной 100 мкм, лучший наименьший след — 9 мкм.
Top 10 package Substrate Manufacturer
Top 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 слой в 20 слои.
Global Semiconductor packaging Manufacturer
Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.
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Электронная почта: info@alcantapcb.com