Trade News Archives - Pagina 50 Di 94 - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD - Pagina 50

Flip Chip CSP (FCCSP) Firm. We produce the High speed and high frequency material packaging substrate from 2 strato a 20 strati. we also offer the Flip Chip CSP package service.

Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 strato a 30 strati.

Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Semiconductor FC BGA substrate quote. possiamo produrre il miglior bump pitch con 100um, la migliore traccia più piccola è 9um.

We are a professional Rigid-flex BGA substrate quote, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs.

We are a professional Rigid-flex packaging substrate quote supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace.