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We are a professional IC Substrate, Produzimos principalmente substrato de pitch bump ultra-pequeno, ultra-small trace and spacing packaging substrate and PCBs.

We are a professional ABF Substrate Manufacturer, Produzimos principalmente substrato de pitch bump ultra-pequeno, Substrato de embalagem de traço e espaçamento ultra-pequeno.

FCBGA substrate: Optimal 100um bump pitch, 9um trace and gap for compact design. Typical: 15-30um trace and spacing.

FCBGA packaging substrate: Optimal 100um bump pitch, 9um trace and gap for compact design. Typical: 15-30um trace and spacing.

Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process.

Produce top-tier Flip Chip Packaging Substrate with 100um bump pitch, 9um trace, and 9um gap for optimal performance.