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Trade News Archives - Página 60 de 94 - TECNOLOGÍA ALCANTA(SHENZHEN)CO., LTD - Página 60

  • What is organic package substrate?

    ¿Qué es el sustrato de paquete orgánico??

    Organic package substrate and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 a 18 capas. Packaging substrates, an essential element within electronic devices, assume a pivotal role. They serve as a vital bridge connecting a multitude of electronic components, papas fritas, and circuits,…
  • Why is it called LED packaging substrate?

    Why is it called LED packaging substrate?

    We are a professional Led package substrate, Producimos principalmente sustratos de paso ultrapequeño., Sustratos de embalaje y PCB con espaciado y trazas ultrapequeños. LED (Light Emitting Diode) technology has seamlessly integrated itself into the fabric of contemporary lighting, electronic devices, and the automotive industry. The extensive utilization of LEDs has not
  • What is substrate in IC packaging?

    ¿Qué es el sustrato en el embalaje de IC??

    This article embarks on an exploration of IC packaging substrates, an indispensable element within the realm of electronics. We will conduct an in-depth examination of the diverse types of IC packaging substrates, delve into current market trends, and underscore their paramount significance within the modern electronics industry. Whether you're an
  • What is the substrate of ICs?

    What is the substrate of ICs?

    In today's digital era, Integrated Circuits (IM) stand as the vital components propelling electronic devices and technology into the future. These minuscule yet immensely powerful chips function as the cognitive centers of electronic devices, housing millions of transistors that execute a diverse array of tasks. Sin embargo, IC chips alone do
  • What is the substrate of the flip chip package?

    What is the substrate of the flip chip package?

    We are a professional flip chip package substrate, Producimos principalmente sustratos de paso ultrapequeño., Sustratos de embalaje y PCB con espaciado y trazas ultrapequeños. Flip chip packaging, a cutting-edge technology in the world of electronic engineering, has revolutionized the way microchips and electronic components are connected and packaged. En este artículo,…
  • Are the two most common materials used in an IC package?

    Are the two most common materials used in an IC package?

    Different types of ic packaging substrates manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology. In the realm of modern electronic devices, the Integrated Circuit Package Substrate (IC package substrate) plays a pivotal role, serving as the crucial link between microchips and the