Flip Chip Package Substrate Manufacturer
Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 capa a 18 capas. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.What are the advanced packaging processes?
What is the FC BGA Package? FC BGA Package Reference Guide. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 capa a 18 layerTecnología de sustrato del paquete Flip Chip
Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. Such as: 10 layer Flip-Chip Package Substrates. 12 layer. 14 layer. o 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…Sustrato de paso ultrapequeño
Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. Entonces. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!Sustrato de paquete avanzado
Advanced Package Substrate manufacturer. We have used Msap and Sap technological process to produce the Package substrates with the Rogers Materials BT Materials, ABF Materials, and other types Materials. The range of main layers of our products is from 4 capa a 18 capas. our company asways made the 10…¿Cuáles son los procesos MSAP y SAP??
Waht's the MSAP and SAP Processes.We have used the Multilayer Sequential Build-Up (MSAP) y procesos semiaditivos (SAVIA). Realizar las trazas/espaciados con sustratos de embalaje FC BGA de 9um/9um. Estas metodologías innovadoras han revolucionado la producción de PCB., ofreciendo capacidades incomparables que impulsan a la industria a nuevas alturas de innovación y eficiencia.