Unlocking the Potential of Organic Substrate Packaging
In the rapidly developing electronics field, the importance of organic substrate packaging cannot be ignored. As a core component of electronic equipment, it affects performance, confiabilidad y costo. Organic substrate packaging provides a solid foundation for our devices, allowing us to rely on a variety of innovative electronic products in…
How FCBGA Packaging Substrate Drives Innovation in the Electronics Industry？
The FCBGA (Flip Chip Ball Grid Array) packaging substrate is a key component of this technology and plays an indispensable role. FCBGA packaging substrate provides a highly integrated solution that can achieve more functions, higher performance and lower energy consumption in miniaturized electronic devices. This compact packaging method not only…
Flip Chip Package Substrate Manufacturer
Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 capa a 18 capas. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.
What are the advanced packaging processes?
What is the FC BGA Package? FC BGA Package Reference Guide. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 capa a 18 layer
Tecnología de sustrato del paquete Flip Chip
Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. Such as: 10 layer Flip-Chip Package Substrates. 12 layer. 14 layer. o 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…
Sustrato de paso ultrapequeño
Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. Entonces. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!
Teléfono: +86 (0)755-8524-1496
Correo electrónico: info@alcantapcb.com