Trade News Archives - Página 64 of 94 - TECNOLOGÍA ALCANTA(SHENZHEN)CO., LTD - Página 64

Build-up Structure FC-BGA/Organic-package , ABF Substrates Supplier leads the industry as a premier manufacturer.With expertise spanning from 4-layer to 14-layer designs, our commitment to excellence is evident in our smallest gap ABF substrates. Employing the SAP technology, we harness the power of ABF base materials to deliver unparalleled quality.

FC-BGA Substrates manufacturer. we have poroduced FC-BGA Substrates from 4 capa a 14 capas. when we use the ABF base materials with the Sap technology. we can produce the substrates with 15um /15um gap and trace. In today's world, electronic devices have become an integral part of our lives. From smartphones…

ABF Substrates Supplier . Smallest gap ABF Substrates manufacturer from 4 capa a 14 capas. when we use the Sap technology. we need to choose the ABF base materials to produce the substrates. we can produce 10 layer o to 14 layer HDI substrates. the substrates gap and trace are…

ABF Substrates Manufacturer. .We use advanced MSAP and SAP production technology to process and produce high multilayer ABF substrates and FC-BGA substrates. We have made the substrates from 4 capa a 14 capas.

Rogers RT/duroid® 5880LZ PCB maker. Dk de 2.00 +/- .04, Bajo factor de disipación que oscila entre .0021 a .0027 a 10GHz, Baja densidad de 1.4 gm/cm3, Bajo coeficiente de expansión térmica del eje Z en 40 ppm/°C.

Rogers RT/duroid® 6002 Fabricación de PCB. Dielectric constant (Dk) of 2.94 +/- .04, Dissipation factor of .0012 a 10GHz, Low thermal coefficient of Dk at 12 ppm/°C, Bajo coeficiente de expansión térmica del eje Z en 24 ppm/°C.