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High Frequency&High Speed PCB/

RF&Microwave PCB

RF&Microwave PCB

RF&Microwave PCB. Multilayer RF&Microwave boards, Hybrids & Mixed Dielectrics, Buried and Blind Vias, and other Advanced production technology. The materials types are Low Loss FR4 materials, High Speed materials, High Frequency materials, If your PCB materials is not in below materials list. please check with us. Too many materials are not show here.

High frequency circuit boards

We buy these materials from an agent at Rogers Materials and then process and produce blank circuit boards. We don’t produce core materials. The following information is for reference only.

High frequency PCB with Rogers material The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component. Depending on various parameters, HF signals are reflected on circuit board, meaning that the impedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control. Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (εr) of the materials used.

ALCANTA PCB provides you with know-how, all popular materials and qualified manufacturing processes – reliably even for complex requirements.

 

 

Rogers PCB

Rogers PCB

High-frequency boards, e.g. for wireless applications and data rates in the upper GHz range have special demands on the material used: Adapted permittivity Low attenuation for efficient signal transmission Homogeneous construction with low tolerances in insulation thickness and dielectric constant For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent. Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate. We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.Materials used for HF circuit boards:

 

Impedance CheckThe impedance defined by the customer is tested by our CAM station engineers on manufacturability. Depending on the layer buildup, the PCB layout and the customer’s requested impedances a calculation model is chosen. The result is any required modification of the layer builduo and the necessary adjustments to the relevant conductor geometries. After the manufacture of high frequency circuit boards, the impedances are checked (with a precision of up to 5%), and the detailed results are recorded exactly in a test protocol.

PropertyTypical Value(1)DirectionUnitConditionTest Method
RO3003RO3035RO3006RO3010
Dielectric Constant, r

Process

 

3.00 ± 0.04

 

3.50 ± 0.05

 

6.15 ± 0.15

 

10.2 ± 0.30

 

Z

 

 

10 GHz 23°C

IPC-TM-650  2.5.5.5

Clamped Stripline

(2) Dielectric Constant, r

Design

 

3.00

 

3.60

 

6.50

 

11.20

 

Z

 

 

8 GHz – 40 GHz

Differential  Phase Length  Method
Dissipation Factor, tan 0.00100.00150.00200.0022Z10 GHz 23°CIPC-TM-650  2.5.5.5
Thermal Coefficient of r-3-45-262-395Zppm/°C10 GHz

-50 to 150°C

IPC-TM-650  2.5.5.5
Dimensional Stability-0.06

0.07

-0.11

0.11

-0.27

-0.15

-0.35

-0.31

X  Ymm/mCOND AIPC TM-650 2.2.4
Volume Resistivity107107105105M•cmCOND AIPC 2.5.17.1
Surface Resistivity107107105105MCOND AIPC 2.5.17.1
Tensile Modulus930

823

1025

1006

1498

1293

1902

1934

X  YMPa23°CASTM D638
Moisture Absorption0.040.040.020.05%D48/50IPC-TM-650  2.6.2.1
Specific Heat0.90.860.8J/g/KCalculated
Thermal Conductivity0.500.500.790.95W/m/K50°CASTM D5470
Coefficient of Thermal  Expansion (-55 to 288 °C)17

16

25

17

17

24

17

17

24

13

11

16

X  Y  Z 

ppm/°C

 

23°C/50% RH

 

IPC-TM-650 2.4.41

Td500500500500°C TGAASTM D3850
Density2.12.12.62.8gm/cm323°CASTM D792
 

Copper Peel Strength

 

12.7

 

10.2

 

7.1

 

9.4

 

lb/in

1 oz. EDC

After Solder  Float

 

IPC-TM-2.4.8

FlammabilityV-0V-0V-0V-0UL 94
Lead Free Process  CompatibleYESYESYESYES

 

 

RO3000® Series Circuit Materials

RO3003™, RO3006™, RO3010™ and RO3035™

High Frequency Laminates

RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.

 RO3000 series laminates are ceramic-filled PTFE based circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multi-layer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems.

 RO3000 materials exhibit a coefficient of thermal expansion (CTE) in the X and Y axis of 17 ppm/oC. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage (after etch and bake) of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/ °C, which provides exceptional plated through-hole reliability, even in severe thermal environments. The dielectric constant versus temperature for RO3003™ and RO3035™ materials is very stable (Chart 1).

 

RO3000 series laminates can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques, with minor modifications as described in the application note “Fabrication Guidelines for RO3000 Series High Frequency Circuit Materials.”

 

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