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ABF Package Substrate/

ALCANTA recommends SHDBU substrates for high-speed with high I/O count flip chip BGA. SHDBU substrates have high-density build-up and CPCORE as a core material, which allows for a finer design rule than with conventional core materials making them thin and Displaying good characteristics for high speed applications. In addition to fine geometry routing at the build-up layer, routing in CPCORE is possible, so it is a suitable technology for full area array flip chip assembly and MCM. Furthermore, critical routing is possible in the CPCORE layer, and is suitable for high speed switching devices and high speed routers.

SHDBU substrates

SHDBU substrates


Layer StructureUp to 4-n-4 
Core Layer Structure5 ~ 25 
Build up Line Width / Space9μm / 12μm 
Core Line Width / Space40μm / 40μm 
Flip Chip Pad Pitch125μm


About the IC Substrates. FC-BGA substrates. SHDBU substrates. FC-CSP Substrates. CPCORE Substrates. Module Substates. MSD substrates, FR substrates, SEN substrates , MIC substrates design and Fabrication questions. please contact with