Rogers RT 6002 PCB manufacturer. Rogers RT/duroid 6002 laminates are low dielectric constant microwave materials for use in complex microwave structures. RT/duroid 6002 laminates are low loss materials that provide excellent high frequency performance. With excellent mechanical and electrical properties, these materials are reliable for use in multi-layer board constructions.
We buy these types materials from an agent at Rogers Materials company and then process and produce blank circuit boards.
- Dielectric constant (Dk) of 2.94 +/- .04
- Low thermal coefficient of Dk at 12 ppm/°C
- Dissipation factor of .0012 at 10GHz
- Low Z-axis coefficient of thermal expansion at 24 ppm/°C
- Low loss for excellent high frequency performance
- Tight thickness control
- In-plane expansion coefficient matched to copper
- Low out-gassing; Ideal for space applications
- Excellent dimensional stability
RT/duroid®6002 microwave material was the first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.
The thermal coefficient of dielectric constant is extremely low from -55oC to+150oC (-67°F to 302°F) which provides the designers of filters, oscillators and delay lines the electrical stability needed in today’s demanding applications. A low Z axis coefficient of thermal expansion (CTE) ensures excellent reliability of plated through-holes. RT/duroid 6002 materials have been successfully temperature cycled (-55oC to 125oC [-67°F to 257°F]) for over 5000 cycles without a single via failure. Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y coefficient of expansion to copper. This often eliminates double etching to achieve tight
positional tolerances. The low tensile modulus (X,Y) greatly reduces the stress applied to solder joints and allows the expansion of the laminate to be constrained by a minimum amount of low CTE metal, (6 ppm/o C) further increasing surface mount reliability. ½ oz. to 2 oz./ft.2 electrodeposited copper, ½ oz. to 1 oz. reverse treated electrodeposited copper or ½ oz. to 2 oz./ ft.2 rolled copper may be specified as cladding on dielectric thicknesses from 0.005” to 0.125” (0.13 to 3.18mm). RT/duroid 6002 laminate is also available clad with aluminum, brass, or copper plates and resistive foils. Applications particularly suited to the unique properties of RT/duroid 6002 material include flat and non-planar structures such as antennas, complex multi-layer circuits with inter-layer connections, and microwave circuits for aerospace designs in hostile environments. RT/duroid 6002 laminates have Underwriters Laboratories recognition under classification 94V-0 (Vertical Flammability Test).
Standard Panel Size:
18” X 12” (457mm X 305mm)
18” X 24” (457mm X 610mm)
Standard Copper Cladding:
½ oz. (18µm) and 1oz (35µm) electrodeposited and rolled copper cladding
Other claddings may be available.
If you have any questions, please feel free to contact us with firstname.lastname@example.org , we will be happy to help you.