News Archives - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD

Leadframe&metal frame for QFN Manufacturer, the lead frame material is C-194F.H, Silver plating on the Leadframe(metal frame) or Au plating on Leadframe(metal frame), we produce the QFN metal frame/Leadframe with high quality and fast lead time. The leadframe is an essential component in the packaging of integrated circuits (ICs), particularly…

Lead Frame for QFN Package Manufacturer, QFN Metal frame production, we have made the QFN Metal frame surface treatment with silver plating or maybe Au plating, about the silver and Au thickness, We will plating thickness according to your requirement. In the world of semiconductor packaging, the lead frame plays…

Millimeter Wave Antenna Board Manufacturer.A millimeter wave antenna board manufacturer specializes in designing and producing advanced antennas that operate in the millimeter wave frequency range, typically from 30 GHz to 300 GHz. These antennas are crucial for high-speed data transmission and applications in telecommunications, radar systems, and satellite communications. The…

Aluminum Substrate Manufacturer.A leading Aluminum Substrate Manufacturer specializing in high-quality, durable aluminum substrates for various industrial applications. We offer innovative solutions with precision engineering, ensuring superior thermal conductivity, electrical insulation, and corrosion resistance. Our products are ideal for LED lighting, power modules, and other electronic components, providing exceptional performance and…

Ultra-Multilayer GPU Substrates Manufacturer .Our company specializes in the design and manufacturing of ultra-multilayer GPU substrates, providing advanced solutions for high-performance computing needs. We utilize cutting-edge technology to produce high-density interconnects that enhance the efficiency and reliability of GPUs. Our substrates are engineered to support the latest graphics processing units,…

18 Layer BGA/IC Substrate Manufacturer. An 18-layer BGA/IC substrate manufacturer specializes in producing high-performance substrates for Ball Grid Array Integrated Circuits (BGA/IC). These substrates are essential for advanced electronic packaging, offering multiple layers to support complex circuit designs. The company ensures precision in fabrication and quality control, providing robust and…