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ABF Package Substrate/

ABF series substrates materials. From 5um to 30um gap substrates Manufacturer. In recent years, IC packages have become necessary to meet the market needs of small and thin substrates required for digital handset equipment. ALCANTA has been enhancing and improving SLC technologies to respond to the market demand for thin and small substrates.
 
FC-CSP Substrates

FC-CSP Substrates

 

Features

Applicable up to 35µm pitch for flip-chip assembly (peripheral). Thin build-up laminate for SiP applications (0.3mmt for 1-2-1). Applicable environmentally-friendly products (Halogen-free, Lead-free). Various surface finish options are available. (Au plating, Lead-free solder coating, OSP, etc.)

 

About the IC Substrates. FC-BGA substrates. SHDBU substrates. FC-CSP Substrates. CPCORE Substrates. Module Substates. MSD substrates, FR substrates, SEN substrates , MIC substrates design and Fabrication questions. please contact with  info@alcantapcb.com 

 

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