Flip Chip Packaging Substrate
Flip Chip Packaging Substrate Manufacturing. We use advanced manufacturing equipment to produce ultra-small spacing substrates. Such as: 10 layer Package Substrates. 12 Layer Package Substrates. 14 layer Package Substrates. If your substrate schematic design specification, it is easier to produce a substrate with less than 10 layers. We have used…Flip-Chip Package Substrate
Flip-Chip Package Substrate manufacturers. FC BGA Package Substrate Suppliers. We have made ABF base Package Substrates from 4 layer to 14 layers. Ultra-small line width line spacing from 12um to 35um. and small size BGA pads. and More bigger than 35um line width and line spacing will be easier to…Build-up Structure FC-BGA/Organic Package
Build-up Structure FC-BGA/Organic-package , ABF Substrates Supplier leads the industry as a premier manufacturer.With expertise spanning from 4-layer to 14-layer designs, our commitment to excellence is evident in our smallest gap ABF substrates. Employing the SAP technology, we harness the power of ABF base materials to deliver unparalleled quality.FC-BGA Substrates Manufacturer
FC-BGA Substrates manufacturer. we have poroduced FC-BGA Substrates from 4 layer to 14 layers. when we use the ABF base materials with the Sap technology. we can produce the substrates with 15um /15um gap and trace. In today's world, electronic devices have become an integral part of our lives. From smartphones…ABF Substrates Supplier
ABF Substrates Supplier . Smallest gap ABF Substrates manufacturer from 4 layer to 14 layers. when we use the Sap technology. we need to choose the ABF base materials to produce the substrates. we can produce 10 layer o to 14 layer HDI substrates. the substrates gap and trace are…ABF Substrates Manufacturer
ABF Substrates Manufacturer. .We use advanced MSAP and SAP production technology to process and produce high multilayer ABF substrates and FC-BGA substrates. We have made the substrates from 4 layer to 14 layers.