ABF series substrates materials. From 5um to 30um gap Substrates Manufacturer.
Our base material is of an optimum type and thinness to meet the requirements of module-mounted products for compactness and high functionality and to enable the micro-fabrication development necessary for the high-density wiring/land size reduction required by such boards.
- Board thickness 0.25mm (6 layered) and 0.18mm (4 layered) achieved by the adoption of ultra- thin base material/prepreg
- Bare chip of 250-150µm ultra-narrow pitch achieved
- High-reliability thinner board suited for any type of layer connection structure
- Plating technology creates an optimum product for side connection on module
|(Maximum build-up layers)||4|
|Line/space (Min)||Inner layer||35/35μm|
|Via diameter (hole/land)||75/110μm (60/90μm)|
|Core thickness (Min.)||0.03mm|
|Thickness between the insulating layer (Min.)||0.025mm|
|Total board thickness (Min.)||1-2-1||0.18mm|
About the IC Substrates. FC-BGA substrates. SHDBU substrates. FC-CSP Substrates. CPCORE Substrates. Module Substates. MSD substrates, FR substrates, SEN substrates , MIC substrates design and Fabrication questions. please contact with email@example.com