Company News Archives - Page 44 of 86 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 44

Semiconductor BGA substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate

Semiconductor IC substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers

Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Substrate Packaging Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers,

Top 10 Packaging Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace packaging substrate from 2~20L