Archivos de noticias de la compañía - Página 49 de 86 - TECNOLOGÍA ALCANTA(SHENZHEN)CO., LTD - Página 49

Professional Wire Bond Substrate Manufacturer, Producimos principalmente sustratos de paso ultrapequeño., ultra-small trace and led PCBs from 2 capa a 20 capas.

Cavity Substrate PCB Manufacturer. High speed and high frequency material cavity packaging substrate and Cavity PCB boards manufacturing. Advanced production technology.

Chip-scale package and scale package substrates Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging service vendor.

Embedded Cavity PCB Substrate Manufacturer. High speed and high frequency material Cavity packaging substrate and Cavity slot PCB manufacturing.

FCCSP FLIP CHIP CSP PAQUETA PAGATIVA Fabricante. We use advanced Msap and Sap technology to produce the High multilayer interconnection FCCSP Flip Chip CSP package substrates. and we also do the FCCSP package service.

Fabricante de sustrato de Cavity PCB. Cavidad profesional PCB y sustratos de componentes integrados Fábrica. Utilizamos procesos de producción incrustados avanzados.