Company News Archives - Page 50 of 86 - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD - Page 50

Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Semiconductor FC BGA substrate quote. possiamo produrre il miglior bump pitch con 100um, la migliore traccia più piccola è 9um.

We are a professional Rigid-flex BGA substrate quote, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs.

We are a professional Rigid-flex packaging substrate quote supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace.

We are a professional Semiconductor substrate quote supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs.

We are a professional Ceramic packaging substrate quote supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace.