Company News Archives - Page 52 of 86 - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD - Page 52

Rigid-flex BGA substrate manufacturer. possiamo produrre il miglior bump pitch con 100um, la migliore traccia più piccola è 9um.

Ceramic package substrate. possiamo produrre il miglior bump pitch con 100um, la migliore traccia più piccola è 9um.

Rigid-Flex BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

We are a professional ABF Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate.

bt-materials-pcb. we have produced boards with BT material. This material has different thicknesses. Like: 0.1mm. 0.15mm.0.2mm.0.25mm.0.3mm to 1.6mm. We produce the BT PCB with High quality and fast lead time. BT resin materials have excellent mechanical, thermal, and electrical properties.

Design rules of substrate in packaging manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology. In today's digital age, a new era of electronic devices and technology is evolving rapidly. One of the drivers of this advancement is packaging technology and substrate design…