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Waht's the MSAP and SAP Processes.We have used the Multilayer Sequential Build-Up (MSAP) e processi semi-additivi (LINFA). Per eseguire tracce/spaziature con substrati di imballaggio FC BGA da 9um/9um. Queste metodologie innovative hanno rivoluzionato la produzione di PCB, offrendo capacità senza precedenti che spingono il settore a nuovi livelli di innovazione ed efficienza.

FC BGA Packaging Substrate Supplier. We have used the Msap and Sap technology to produce the the smallest Packaging Substrate with 9um gap. and the lines width are 9um too. we can produce the FC BGA Packaging Substrate from 2 strato a 16 strati. the best smallest via holes size…

Flip Chip Package Substrate suppliers.We have used the Msap and Sap technology to produce the Flip Chip Package Substrates from 4 L to 16 strati. The substrates base(core) materials are the BT base materials. ABF base materials. High frequency and high speed materials. and others. Our company offer high quality…

Flip Chip Packaging Substrate Manufacturing. 90% of our production equipments were purchased in Japan. We use advanced manufacturing equipment to produce ultra-small spacing substrates. Ad esempio: 10 layer Package Substrates. 12 Layer Package Substrates. 18 layer Package Substrates. If your substrate schematic design specification, it is easier to produce a…

Flip-Chip Package Substrate manufacturers. FC BGA Package Substrate Suppliers. We have made ABF base Package Substrates from 4 strato a 18 strati. Ultra-small line width/line spacing with 9um/ 9um. and small size BGA pads. and More bigger than 20um line width and line spacing will be easier to produce. we…

Build-up Structure FC-BGA/Organic-package , ABF Substrates Supplier leads the industry as a premier manufacturer.With expertise spanning from 4-layer to 14-layer designs, our commitment to excellence is evident in our smallest gap ABF substrates. Employing the SAP technology, we harness the power of ABF base materials to deliver unparalleled quality.