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Blind Vias&Buried Vias PCB manufacturing. Super small spacing, super small via holes HDI PCBs. we offer high quality Blind Vias&Buried Vias from 4 strato a 50 strati. fast shipping time. and high quality.

Ceramic PCB Substrates manufacturing. Utilizziamo la tecnologia avanzata Msap e Sap, Substrati di interconnessione multistrato elevati da 4 A 18 strati,

Cross blind/interrato tramite produzione PCB. il Package Substrate sarà realizzato con materiali Showa Denko e Ajinomoto High speed.

3D Pacchetti ceramici Produzione di substrati, Advanced production technology. we offer 2D Ceramic Substrate, 2.5D Ceramic Substrate.

Mixed dielectric PCB manufacturing.High speed and high frequency material packaging substrate manufacturing. Substrato di imballaggio avanzato.

Microvia Substrates manufacturing. the best smallest vias holes size are 50um. the Package Substrate will be made with BT core, Showa Denko and Ajinomoto High speed materials. or other types core materials.