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Global Packaging Substrate Manufacturer. Podemos producir el mejor lanzamiento de Samllest Bump con 100um, La mejor traza más pequeña son 9um.

Top 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 capa a 20 capas.

Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Global package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production.

Module Substrates Manufacturer, Producimos principalmente sustratos de paso ultrapequeño., ultra-small trace and PCBs from 4 capa a 20 capas.

Global Semiconductor Substrate Manufacturer. We use advanced Msap and Sap technology to manufacturing High multilayer interconnection package substrates.