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Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 a 18 capas

Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Substrate Packaging Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 a 18 capas,

Top 10 Packaging Substrate Manufacturer, Producimos principalmente sustratos de paso ultrapequeño., ultra-small trace packaging substrate from 2~20L

Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 capa a 20 capas.

Global Packaging Substrate Manufacturer. Podemos producir el mejor lanzamiento de Samllest Bump con 100um, La mejor traza más pequeña son 9um.