News Archives - Página 54 of 96 - TECNOLOGÍA ALCANTA(SHENZHEN)CO., LTD - Página 54

Rigid-Flex Packaging Substrate. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

We are a professional Semiconductor substrate, Producimos principalmente sustratos de paso ultrapequeño., ultra-small trace and PCBs.

Ceramic Packaging Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.high frequency materials.

We are a professional IC Substrate, Producimos principalmente sustratos de paso ultrapequeño., Sustratos de embalaje y PCB con espaciado y trazas ultrapequeños.

We are a professional ABF Substrate Manufacturer, Producimos principalmente sustratos de paso ultrapequeño., ultra-small trace and spacing packaging substrate.

FCBGA substrate: Optimal 100um bump pitch, 9um trace and gap for compact design. Typical: 15-30um trace and spacing.