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Embedded Cavity PCB Substrate Manufacturer. High speed and high frequency material Cavity packaging substrate and Cavity slot PCB manufacturing.

FCCSP FLIP CHIP CSP PAQUETA PAGATIVA Fabricante. We use advanced Msap and Sap technology to produce the High multilayer interconnection FCCSP Flip Chip CSP package substrates. and we also do the FCCSP package service.

Fabricante de sustrato de Cavity PCB. Cavidad profesional PCB y sustratos de componentes integrados Fábrica. Utilizamos procesos de producción incrustados avanzados.

Flip Chip CSP (FCCSP) Firme. We produce the High speed and high frequency material packaging substrate from 2 capa a 20 capas. we also offer the Flip Chip CSP package service.

Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 capa a 30 capas.

Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.