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Подложки FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions. We have developed ultra high density wiring substrates with our original microfabrication and build-up wiring technologies, offering products supporting current semiconductor microfabrication.For a growing demand for LSIs for…

Мегтрон 7 Поставщик печатных плат,Megtron7GN,R-5785(GN)/R-5680(GN),Megtron7GE, R-5785(GE)/R-5680(GE), Ultra-low Loss,Highly Heat Resistant Circuit Board Materials. The ultra-low dielectric constant (Дк) and dissipation factor (Df) make MEGTRON 7 ideal for high speed and large data volumes associated with servers and routers required for 5G. The MEGTRON 7 family, including MEGTRON 7(N), MEGTRON 7(GE) и…

Minimum Trace&Gap PCB manufacturer. The smallest clearance between trace to trace or Pads to Pads are 1.4mil(35um). we offer the smallest Pads Pitch with 160um(7.1мил). Such as FCBGA packaging products.

Схемы Ro4350B,Ro4350B PCB Supplier, Rogers 4350B PCB fabrication. Дк из 3.48 +/- 0.05, Коэффициент рассеивания 0.0037 в 10 ГГц, Fast shipping time. and more cheap price Rogers 4350b PCB Manufacturer.

Печатная плата Роджерс 4003C, Плата Ro4003C. Ro4003C Схемы. Справочник материалов: Дк из 3.38 +/- 0.05,Коэффициент рассеивания 0.0027 в 10 ГГц. High quality Rogers PCB fabrication. Более низкая стоимость. и время доставки быстрое.

Ro4350B PCB, Rogers 4350B PCB Manufacturing. Дк из 3.48 +/- 0.05, Коэффициент рассеивания 0.0037 в 10 ГГц, High quality Rogers PCB Supplier. Fast shipping time. and Low cost. we will help you save time.