Trade News Archives - Page 43 of 94 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 43

Bt laminate PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high.

Cavity substrate manufacturing. High speed and high frequency material Cavity packaging substrate manufacturing. Advanced cavity(slot) production technique. we make the cavity PCBs from 4 layer to 30 layers.

Bt laminate substrate manufacturing, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate.

Ultrathin BT PCB manufacturing, we mainly produce Ultrathin and ultra-small bump pitch BGA substrate, ultra-small trace and spacing LED PCBs, and other types BGA package substrate.

Professional Low CET PCB manufacturing, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing PCB and package substrate.

Ultrathin BT PCB manufacturing. we can produce the best samllest thin PCB with 0.07mm, the best smallest trace and spacing are 9um/9um.