Trade News Archives - Pagina 44 Di 94 - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD - Pagina 44

Ultrathin BT PCB manufacturing. we can produce the best samllest thin PCB with 0.07mm, the best smallest trace and spacing are 9um/9um.

Rigid-flex packaging substrate Firm. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates.

Semiconductor FC-BGA substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection.

Semiconductor BGA substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate

Semiconductor IC substrate Manufacturer. possiamo produrre il miglior bump pitch con 100um, la migliore traccia più piccola è 9um.

Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 A 18 strati