Trade News Archives - Pagina 45 Di 94 - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD - Pagina 45

Substrate Packaging Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 strati,

Top 10 Packaging Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace packaging substrate from 2~20L

Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 strato a 20 strati.

Global Packaging Substrate Manufacturer. possiamo produrre il miglior bump pitch con 100um, la migliore traccia più piccola è 9um.

Top 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 strato a 20 strati.

Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.