Substrate package Manufacturer
Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.Substrate Packaging Manufacturer
Substrate Packaging Manufacturer. Utilizziamo la tecnologia avanzata Msap e Sap, Substrati di interconnessione multistrato elevati da 4 A 18 strati,Top 10 Packaging Substrate Manufacturer
Top 10 Packaging Substrate Manufacturer, produciamo principalmente substrati a passo d'urto ultra-piccoli, ultra-small trace packaging substrate from 2~20LOrganic Packaging Chip Substrates Manufacturer
Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 strato a 20 strati.Global Packaging Substrate Manufacturer
Global Packaging Substrate Manufacturer. possiamo produrre il miglior bump pitch con 100um, la migliore traccia più piccola è 9um.Top 10 package Substrate Manufacturer
Top 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 strato a 20 strati.
TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD 




