Trade News Archives - Pagina 47 Di 94 - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD - Pagina 47

High Speed package Substrate Manufacturer. High speed and high frequency material PCB and packaging substrate manufacturing.

SHDBU Substrates Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection package substrates from 4 A 20 strati.

Produttore di substrati per imballaggi ad alta precisione. il Package Substrate sarà realizzato con materiali Showa Denko e Ajinomoto High speed. or other high quality base package substrate or PCB boards materials.

High Frequency package Substrate Manufacturer. the Package Substrate will be made with Rogers materials(High Frequency base). or Showa Denko, Ajinomoto High speed materials.

Organic Package Manufacturer. the Package Substrate will be made with BT, Rogers, Showa Denko and Ajinomoto High speed materials. We also offer Organic Package service.

Organic Substrate FC BGA substrate Manufacturer. Produzione di substrati per imballaggi in materiale ad alta velocità e ad alta frequenza.