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Professional Embedded Cavity Substrate Manufacturer, we mainly produce Embedded Cavity PCB and Embedded Cavity Substrates. to use the BT base and rogers baes or other types High frequency and high speed substrate materials.

Fabricante de sustrato del paquete Flip Chip FCCSP. Podemos producir el mejor lanzamiento de Samllest Bump con 100um, the best smallest trace and spacing are 9um/9um. Use the Ajinomoto(ABF) base material or other types High frequency and high speed substrate materials.

Fabricante de sustrato de cavidad BGA. We are professional Cavity PCB & Embedded components and parts substrates company. Podemos hacer la ranura de la cavidad con la capa dieléctrica mixta..

Fabricante de envases orgánicos. We use advanced Msap and Sap technology to make the High multilayer interconnection package substrates from 4 a 20 capas. and our company also do the Organic Packaging service.

Fabricante de sustrato de paquete BT FCCSP. the Package Substrate will be made with BT base, Showa Denko and Ajinomoto High speed materials. or other types High speed and high frequency materials.

CSP package substrate Manufacturer. Fabricación de sustratos de embalaje de materiales de alta velocidad y alta frecuencia.. Advanced packaging substrate firm.