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High Speed package Substrate Manufacturer. High speed and high frequency material PCB and packaging substrate manufacturing.

SHDBU Substrates Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection package substrates from 4 a 20 capas.

High precision packaging substrate Manufacturer. El sustrato del paquete se fabricará con materiales Showa Denko y Ajinomoto High speed.. or other high quality base package substrate or PCB boards materials.

High Frequency package Substrate Manufacturer. the Package Substrate will be made with Rogers materials(High Frequency base). or Showa Denko, Ajinomoto High speed materials.

Fabricante de envases orgánicos. the Package Substrate will be made with BT, Rogers, Showa Denko and Ajinomoto High speed materials. We also offer Organic Package service.

Sustrato orgánico FC BGA fabricante de sustrato. Fabricación de sustratos de embalaje de materiales de alta velocidad y alta frecuencia..